Silver Paste Adhesive

 

 ball02d.gifCONDUCTIVE ADHESIVES

   CON-COAT SERIES, as conductive materials for electronic parts, was independently developed with our unique technology. The metal powder used in the paste can also be produced with our own plant. From these, we can supply the paste with excellent quality and precious fine metal powder. Now, we proceed the consistent batch to batch quality assurance, just in time delivery and in-depth technical support on paste application. In addition, we can supply a variety of paste adequate to user's condition and request.

Product No.

Composition

Curing Condition

Key Features

DS-0515A

Ag

150 oC×30Min

Quartz Crystal Bonding, Solvent Type

DS-0715A

Ag

150 oC×30Min

Quartz Crystal Bonding, Solvent Type,

Good Adhesion, High Thermal Stability

DS-0915A

Ag

150 oC×30Min

Quartz Crystal Bonding, Solvent-free Type

DS-0715AT

Ag

150 oC×30Min

Adhesive for Chip Tantalum Capacitor,

High Reliability

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