Silver Paste for PZT and BEADS 

 ball02d.gif Inner Electrodes for Chip Bead Inductor

 

Product No.

Composition

Applying Method

Firing Condition

Key Features

DS-0078IE

Ag

Screen Printing

900 oC

Chip-Bead/Inductor, Good Line Resolution, Low Electric Resistance

DS-0081IE

Ag

Screen Printing

900 oC

Chip-Bead/Inductor, Good Line Resolution, Low Electric Resistance

DS-0084IEC

Ag

Screen Printing

880 oC

Chip-Inductor, Good Line Resolution, Low Electric Resistance For Ceramic System

DS-0086IE

Ag

Screen Printing

900 oC

Chip-Bead/Inductor, Good Line Resolution, Low Electric Resistance

DS-0088IE

Ag

Metal Masking

900 oC

Chip-Bead/Inductor, Making Via-Hole

DS-0086IEC

Ag

Screen Printing

880 oC

Chip-Inductor, Good Line Resolution, Low Electric Resistance For Ceramic System

DS-0090IED

Ag

Metal Masking

880 oC

Chip-Inductor, Making Via-Hole,Good Line Resolution, Low ElectricResistance

DS-7872BK

Glass/Pigment

Screen Printing

900 oC

 Black Marking for Chip-Inductor

 ball02d.gifTermination Electrodes for Chip-Bead/Inductor

Product No.

Composition

Drying Condition

Firing Condition

Key Features

DS-7470EBF

Ag

150¡ÉX5min

600 - 650 oC

Electroplating & Good Solderability

DS-7470EBA

Ag

150¡ÉX5min

600 - 650 oC

Electroplating & Good Solderability

 

 ball02d.gifCONDUCTIVE PASTE FOR PZT

Product No.

Composition

Firing Condition

Key Features

DS-7140P

Ag

700 oC X 7min

PZT Ignition

DS-7255P

Ag

700 oCX 7min

Good Solderability, PZT Buzzer

DS-7260P

Ag

700 oC X 7min

Good Adhesion, PZT Filter

DS-7170P

Ag

750 oC X 7min

PZT

DS-9157IE

Ag(90)/Pd(10)

1000 oC

Chip-PZT, Inner Electrode, Low Weight Gain, Low Thermal Expansion During Oxidation

DS-9257IE

Ag(80)/Pd(20)

1050 oC

Chip-PZT, Inner Electrode, Low Weight Gain, Low Thermal Expansion During Oxidation

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