Thick Film Material for Ceramic Capacitor
 
|
 Inner
electrode for MLCC
|
|
CON-COAT SERIES, as conductive
materials for electronic parts, was independently developed with our unique technology.
The metal powder used in the paste can also be produced with our own plant. From these, we
can supply the paste with excellent quality and precious fine metal powder. Now, we
proceed the consistent batch to batch quality assurance, just in time delivery and
in-depth technical support on paste application. In addition, we can supply a variety of
paste adequate to user's condition and request. |
Product No. |
Composition |
Drying Condition |
Firing Condition.
|
Key Features |
DS-9057IE |
Pd |
80 oCX4min |
1350 oC |
Low weight gain, Low
Thermal expansion during oxidation
Screen Printing
High Pattern
Definition, Compatible with Specific Sheet Binder Systems |
DS-9157IE |
Ag(90)/Pd(10) |
80 oCX4min |
1000 oC |
DS-9257IE |
Ag(80)/Pd(20) |
80 oCX4min |
1050 oC |
DS-9357IE |
Ag(70)/Pd(30) |
80 oCX4min |
1100 oC |
DS-9457IE |
Ag(60)/Pd(40) |
80 oCX4min |
1150 oC |
DS-9557IE |
Ag(50)/Pd(50) |
80 oCX4min |
1200 oC |
DS-9657IE |
Ag(35)/Pd(65) |
80 oCX4min |
1250 oC |
DS-8943IE |
Ni |
80 oCX4min |
1250 oC |
|
Termination electrode for MLCC
|
 |
CON-COAT SERIES, as conductive
materials for electronic parts, was independently developed with our unique technology.
The metal powder used in the paste can also be produced with our own plant. From these, we
can supply the paste with excellent quality and precious fine metal powder. |
Product No. |
Composition |
Drying Condition |
Firing Condition |
Key Features |
DS-7472EBXX
SERIES |
Ag |
200 oCX4min |
800 oC |
Electroplating &
Good Solderability |
DS-7472EBLX
SERIES |
Ag |
200 oCX4min |
650 oC |
Electroplating &
Good Solderability |
DS-7375EB |
Ag/Pd |
150 oCX10min |
650 oC |
Good Solderability
& Less leached |
DS-7775EB |
Ag/Pd/Pt |
150 oCX10min |
650 oC |
Good Solderability
& Less leached |
DS-8970EB |
Cu |
150 oCX10min |
750 oC |
Electroplating &
High thermal stability |
DS-8870EB |
Ag/Cu |
150 oCX10min |
700 oC |
Electroplating &
High thermal stability |
|
Silver paste for Disk Ceramic
Capacitor |
 |
CON-COAT SERIES, as conductive materials for
electronic parts, was independently developed with our unique technology. The metal powder
used in the paste can also be produced with our own plant. From these, we can supply the
paste with excellent quality and precious fine metal powder. |
Product No. |
Composition |
Firing Condition |
Key Features |
DS-7250 |
Ag |
800 oCX 10min |
HIK, Good
Solderability |
DS-7255 |
Ag |
800 oCX 10min |
TC, HIK, Good Solder
Leach Resistance |
DS-7260 |
Ag |
800 oC X 10min |
TC, HIK, Good Solder
Leach Resistance |
DS-7265 |
Ag |
800 oC X 10min |
High Voltage
Capacitor |
DS-7170 |
Ag |
800 oC X 10min |
High Voltage
Capacitor |
DS-7175 |
Ag |
800 oC X 10min |
High Voltage
Capacitor |
DS-7185 |
Ag |
800 oC X 10min |
High Voltage
Capacitor |
DS-7255SP |
Ag |
800 oC X 10min |
TC, HIK, Good Solder
Leach Resistance |
DS-7260SP |
Ag |
800 oC X 10min |
TC, HIK, Good Solder
Leach Resistance |
DS-7168F |
Ag |
800 oC X 10min |
Filter and C-network |
DS-7180DP |
Ag |
750¡800 oC X 10min |
Microwave Resonator,
Good Solderability |
DS-7180SS |
Ag |
750¡800¢ªC X 10min |
Microwave Resonator,
Good Solderability |
DS-7788PB |
Ag |
705¡800 oC X 10min |
Brush Type |
|
| Tubular ceramic capacitor |
 |
CON-COAT SERIES, as conductive materials for
electronic parts, was independently developed with our unique technology. The metal powder
used in the paste can also be produced with our own plant. From these, we can supply the
paste with excellent quality and precious fine metal powder. |
Product No. |
Composition |
Firing Condition |
Key Features |
DS-7154TB |
Ag |
750 oC X 10min |
Tubular Capacitor
Inner Electrode |
DS-7168TB |
Ag |
760 oC X 10min |
TC, HIK |
|
